Thermal Grizzly TG Putty Advance 30G – Non-Conductive Thermal Pad Alternative, 0.2–3.0mm Gap Filler, GPU VRAM/VRM Use, Good Thermal Conductivity, Easy to Apply

Expert Features

• Designed for GPU Modding: Ideal for replacing thermal pads on graphics cards and adapting to various cooler configurations.
• High Flexibility: Easily molded into shape for precise application on components like VRAM, SMDs, and VRMs.
• Good Thermal Conductivity: TG Putty Advance delivers reliable thermal transfer for high-performance GPU cooling.
• Gap Filling Precision: Efficiently fills height differences from 0.2 mm to 3.0 mm, eliminating uneven contact issues.
• Electrically Non-Conductive: Safe to use around sensitive electronics with no risk of electrical shorts.
• Customizable Application: Apply using included spatulas for broad coverage or by hand (with gloves) for targeted spots.
• Scalable Usage: One 30g container is typically enough for most single or even high-end GPUs like the RTX 4090 (front-side).
• Alternative to Thermal Pads: Simplifies replacements by avoiding the need for multiple pad thicknesses.
• Temperature Resilient: Operates effectively in environments from -40°C to +120°C.
• Includes Tools: Comes with 3 spatulas for easy and controlled spreading.
• Not for CPUs or GPU Dies: Specifically engineered for PCB-to-cooler use cases—not suitable for direct die application.
• Clean Application Surface Required: For optimal results, clean surfaces thoroughly before applying (use TG Cleaning Wipes or isopropyl alcohol).

Expert Specs