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SKU:
TG-MP8-100-100-05-1R
Thermal Grizzly Minus Pad 8 | 100x100x0.5mm | High Thermal Conductivity | Compressible & Electrically Insulating | -100°C to +250°C | RoHS Compliant
$ 20.00 ---ONLY---
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Description
Expert Features:
- Ultra-High Thermal Conductivity: Designed to fill microgaps between components, Minus Pad 8 offers excellent heat transfer efficiency for advanced cooling applications.
- Flexible & Compressible Surface: Built with a highly elastic and adaptable structure, allowing it to conform easily to uneven surfaces for optimal thermal contact.
- Premium Material Composition: Made from a ceramic silicon complex and nano aluminum oxide, ensuring long-term stability and consistent thermal performance.
- Electrically Insulating: Safely used around sensitive electronics, offering electrical insulation of 8 kV/mm, compliant with ASTM D149 standards.
- Wide Operating Temperature Range: Delivers reliable performance from -100°C up to +250°C, making it suitable for extreme environments.
- Eco-Friendly & RoHS Compliant: Manufactured with non-toxic, environmentally safe materials, aligning with RoHS standards for responsible tech use.
- Quick & Simple Installation: Requires only minimal pressure to apply—perfect for CPUs, GPUs, VRMs, RAM modules, and other high-temperature ICs.
- Non-Flammable (UL94 V-0 Rated): Engineered to resist ignition and flame propagation, adding another layer of system safety.
- Ideal for Pros: Trusted by PC builders, and thermal engineers for bridging thermal gaps where paste isn’t practical.
Expert Specs:
| Specification | Details |
|---|---|
| Product Name | Thermal Grizzly Minus Pad 8 |
| Size | 100 x 100 mm |
| Thickness | 0.5 mm |
| Color | Pink |
| Thermal Conductivity | Very High (Exact value depends on thickness) |
| Material Composition | Ceramic Silicon Complex + Nano Aluminum Oxide |
| Compressibility | High |
| Hardness | Shore 00-60 |
| Electrically Insulating | Yes (8kV/mm, ASTM D149) |
| Flammability Rating | UL94 V-0 |
| Operating Temperature | -100°C to +250°C |
| Installation Method | Light pressure — adhesive-free |
| RoHS Compliant | Yes |
| Application Use | CPUs, GPUs, VRMs, Chipsets, Memory Modules |
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