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SKU:
TG-CA-38-38-02-R
Thermal Grizzly Carbonaut 38x38x0.2mm – Reusable Carbon Thermal Pad with High Conductivity, Flexible Soft Gap Filler for CPUs, Consistent Long-Term Cooling Performance
$ 17.00 ---ONLY---
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Description
. Expert Features
- High Thermal Conductivity: Carbon fiber structure ensures efficient heat transfer between CPU and cooler with minimal contact pressure.
- Reusable Design: Unlike thermal paste, Carbonaut pads are removable and reusable, ideal for frequent system upgrades or testing.
- Soft Gap Filler Flexibility: Adapts easily to surface irregularities, compensating for micro-level imperfections on the IHS or heatsink base.
- Long-Term Stability: Maintains thermal performance over time without drying, pumping out, or requiring reapplication.
- Ready-to-Use Format: Pre-cut to 38×38 mm — perfectly sized for Intel HEDT (20xx) and AMD desktop CPUs such as the 7900X or 2700X.
- No Mess, No Fuss: No spreading, curing, or cleanup needed—perfect for hassle-free installation and re-installation.
- Light Pressure Activation: Delivers optimal conductivity under low mounting pressure, making it suitable for both air and liquid coolers.
- Consistent Performance: Ensures even thermal distribution across the IHS surface, providing reliable results under full load.
- Carbon-Based Polymer Matrix: Engineered for flexibility and durability, with a stable molecular structure even at extreme temperatures.
- Multiple Size Options Available: Carbonaut is offered in a variety of standard CPU/GPU sizes for versatile system compatibility.
⚠️ Note: Carbonaut is electrically conductive. Avoid contact with exposed electrical traces or components.
Expert Specs
| Specification | Details |
|---|---|
| Product Name | Thermal Grizzly Carbonaut |
| Material | Carbon Fiber Polymer Composite |
| Pad Dimensions | 38 mm x 38 mm |
| Thickness | 0.2 mm |
| Color | Black |
| Operating Temperature | -250°C to +150°C |
| Thermal Conductivity | High (Carbon-based structure) |
| Electrically Conductive | Yes |
| Reusable | Yes |
| Compatible CPUs | Intel 20xx HEDT, AMD AM4/AM5 (e.g., 7900X, 2700X, 1800X) |
| Application | CPUs / Heatsinks (Air or Liquid Cooling) |
| Installation Method | Tool-free, peel-and-place |
| Durability | Long-Term (Does not dry or degrade) |
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HP EliteDesk 800 G3 Desktop Computer With Intel Core I5-7500, 16GB DDR4 RAM , 512GB SSD, UHD Graphics , USB-C, Windows 10 , Small Form Factor, Tool-Less Access | USED
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