SKU: AP12-85*45-2.0MM
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Maxtor AP-12 High-Performance Silicone Thermal Pad, 14.8W/m·K Thermal Conductivity, 85 × 45 × 2.0mm, Electrically Insulating, Cut-to-Fit for GPU VRAM, VRM, SSD & Laptop Cooling | Grey

$ 8.00

Description

Expert Features

  • 14.8 W/m·K Thermal Conductivity: High-performance thermal interface designed to transfer heat efficiently between electronic components and compatible cooling surfaces.
  • 2.0 mm Precision Thickness: Pre-formed silicone pad suitable for cooling assemblies requiring a 2.0 mm thermal gap interface.
  • 85 × 45 mm Rectangular Sheet: Compact cut-to-fit format for targeted graphics-card, laptop, and electronics repair applications.
  • Electrical Insulation: Non-electrically conductive silicone helps reduce short-circuit risks around sensitive electronic components.
  • High Compressibility: Conformable material helps fill minor surface irregularities under appropriate heatsink mounting pressure.
  • GPU VRAM & VRM Cooling: Suitable for compatible graphics-card memory chips and voltage-regulation components requiring the specified thickness.
  • M.2 SSD & Motherboard Cooling: Can be trimmed for SSDs, chipsets, memory modules, and integrated circuits with matching thermal-interface requirements.
  • Wide Operating Temperature Range: Manufacturer-specified operating temperature range of −50°C to +250°C.
  • Clean, Pre-Formed Installation: Cut to the required dimensions, remove the protective films, and position without spreading thermal grease.
  • Non-Curing Silicone Material: Flexible thermal interface designed to remain non-curing rather than hardening into a rigid compound.
  • Custom Cut-to-Fit Design: Trim the 85 × 45 mm sheet to individual component footprints while preserving its nominal 2.0 mm thickness.
  • Laptop & Desktop Thermal Servicing: Suitable for compatible gaming PCs, graphics cards, laptops, workstations, and electronic assemblies

Expert Specs

SpecificationDetails
BrandMaxtor
ModelAP-12
Product TypeHigh-Performance Thermal Pad
MaterialSilicone Thermal Interface Material
Thermal Conductivity14.8 W/m·K
Length85 mm
Width45 mm
Sheet Dimensions85 × 45 mm
Thickness2.0 mm
ShapeRectangular, Cut-to-Fit Sheet
ColorGray
Electrical PropertiesElectrically Insulating / Non-Conductive
CompressibilityHigh Compressibility
Curing BehaviorNon-Curing
Operating Temperature−50°C to +250°C
Hardness30–55 Sc (Manufacturer Notation)
Installation MethodCut, Remove Protective Films, Position
Primary ApplicationsGPU VRAM/GDDR, VRM, Motherboard Components
Additional ApplicationsM.2 SSDs, Memory Modules, Chipsets, Integrated Circuits
Cooling Surface CompatibilitySuitable Heatsinks, Including Aluminum
Manufacturer-Listed Shelf Life5 Years
Manufacturer-Listed ComplianceRoHS, REACH, ISO (Specific ISO Standard Not Identified)

Installation note: Use this 2.0 mm thermal pad only where the original cooling assembly specifies a compatible thickness. A thinner pad may not make complete contact; a thicker one could prevent the heatsink from seating correctly. Do not automatically substitute a thermal pad for thermal