SKU:
AP12-120*20-1MM
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Maxtor AP-12 High-Performance Silicone Thermal Pad, 14.8W/m·K Thermal Conductivity, 120 × 20 × 1.0mm, Electrically Insulating, Cut-to-Fit for GPU VRAM, VRM, SSD & Laptop Cooling | Grey
$ 4.00
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Description
Expert Features
- 14.8 W/m·K Thermal Conductivity: High-performance silicone thermal interface material designed to transfer heat from electronic components into compatible cooling surfaces.
- 1.0 mm Precision Thickness: Pre-formed thermal pad for cooling assemblies requiring a 1.0 mm gap-filling interface between components and heatsinks.
- 120 × 20 mm Long Strip: Slim 6:1 rectangular format suited to elongated contact areas and accurately trimmed replacement pads.
- Electrically Insulating: Non-electrically conductive silicone provides electrical insulation around sensitive electronic components.
- High Compressibility: Soft, flexible construction conforms to minor surface irregularities under appropriate heatsink pressure.
- GPU VRAM & VRM Cooling: Suitable for compatible graphics-card memory chips and voltage-regulation components requiring 1.0 mm thermal pads.
- SSD & Motherboard Applications: Can be cut for appropriately sized M.2 SSDs, chipsets, memory modules, and integrated circuits.
- Wide Operating Temperature Range: Manufacturer-specified operating temperature of −50°C to +250°C.
- Clean, Pre-Formed Installation: Cut to the required size, remove protective liners, and position without spreading conventional thermal grease.
- Non-Curing Silicone Material: Maintains its non-curing thermal-interface properties rather than hardening into a rigid compound.
- Custom Cut-to-Fit Design: Trim the strip into smaller pieces while retaining its original 1.0 mm nominal thickness.
- Laptop & Desktop Servicing: Suitable for compatible gaming PCs, graphics cards, laptops, workstations, and electronic-device maintenance.












Expert Specs
| Brand | Maxtor |
|---|---|
| Model | AP-12 |
| Product Type | High-Performance Thermal Pad |
| Material | Silicone Thermal Interface Material |
| Thermal Conductivity | 14.8 W/m·K |
| Length | 120 mm |
| Width | 20 mm |
| Sheet Dimensions | 120 × 20 mm |
| Thickness | 1.0 mm |
| Length-to-Width Ratio | 6:1 |
| Shape | Long Rectangular Strip |
| Color | Gray |
| Electrical Properties | Electrically Insulating / Non-Conductive |
| Curing Behavior | Non-Curing |
| Material Conformability | Flexible / Compressible |
| Operating Temperature | −50°C to +250°C |
| Hardness | 30–55 Sc (Manufacturer Notation) |
| Installation Method | Cut, Remove Protective Films, Position |
| Primary Applications | GPU VRAM/GDDR, VRM, Motherboard Components |
| Additional Applications | M.2 SSDs, Memory Modules, Chipsets, Integrated Circuits |
| Compatible Cooling Surfaces | Suitable Heatsinks, Including Aluminum |
| Manufacturer-Listed Shelf Life | 5 Years |
Installation note: Match the 1.0 mm thickness to the equipment’s original thermal gap. A thinner pad may fail to make contact, while a thicker one may prevent the heatsink from seating correctly. Avoid substituting it directly for thermal paste on bare CPU or GPU dies unless specified by the equipment manufacturer.















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