Maxtor AP-12 High-Performance Silicone Thermal Pad, 14.8W/m·K Thermal Conductivity, 85 × 45 × 1.0mm, Electrically Insulating, Cut-to-Fit for GPU VRAM, VRM, SSD & Laptop Cooling | Grey

Expert Features

• 14.8 W/m·K Thermal Conductivity: High-performance silicone thermal interface designed for effective heat transfer between electronic components and compatible heatsinks.
• 1.0 mm Precision Thickness: Pre-formed thermal material for cooling assemblies specifically requiring a 1 mm gap-filling interface.
• 85 × 45 mm Rectangular Sheet: Compact format suitable for targeted electronics repairs and multiple custom-cut thermal contact surfaces.
• Electrically Insulating: Non-electrically conductive silicone formulation helps reduce the risk of accidental electrical shorts around sensitive components.
• High Compressibility: Flexible silicone construction conforms to minor surface irregularities under appropriate mounting pressure.
• GPU VRAM & VRM Cooling: Suitable for graphics-card memory and voltage-regulation components requiring a correctly sized 1.0 mm thermal pad.
• M.2 SSD & Motherboard Cooling: Can be trimmed for compatible SSDs, chipsets, memory modules, and integrated circuits.
• Wide Operating Temperature Range: Manufacturer-specified operating temperature range of −50°C to +250°C.
• Clean, Pre-Formed Installation: Cut to size, remove protective films, and position between the component and cooling surface without spreading thermal grease.
• Non-Curing Silicone Material: Remains a flexible thermal interface instead of curing into a rigid compound.
• Custom Cut-to-Fit Design: Trim the rectangular sheet into application-specific shapes while retaining its original 1.0 mm nominal thickness.
• Laptop & Desktop Maintenance: Suitable for compatible gaming PCs, graphics cards, laptops, workstations, and electronics servicing.

Expert Specs

Installation note: Use the 1.0 mm pad only where the original cooling assembly requires that thickness. An undersized pad can prevent contact, while an excessively thick pad may disrupt heatsink mounting. This product should not automatically replace thermal paste directly on a bare CPU or GPU die.