SKU:
AP12-85*45-1.5M
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Maxtor AP-12 High-Performance Silicone Thermal Pad, 14.8W/m·K Thermal Conductivity, 85 × 45 × 1.5mm, Electrically Insulating, Cut-to-Fit for GPU VRAM, VRM, SSD & Laptop Cooling | Grey
$ 7.00
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Description
Expert Features
- 14.8 W/m·K Thermal Conductivity: High-performance thermal interface designed to transfer heat efficiently between electronic components and compatible cooling surfaces.
- 1.5 mm Precision Thickness: Pre-formed silicone pad suitable for cooling assemblies requiring a 1.5 mm thermal gap interface.
- 85 × 45 mm Rectangular Sheet: Compact cut-to-fit format for targeted graphics-card, laptop, and electronics repair applications.
- Electrical Insulation: Non-electrically conductive silicone helps reduce short-circuit risks around sensitive electronic components.
- High Compressibility: Conformable material helps fill minor surface irregularities under appropriate heatsink mounting pressure.
- GPU VRAM & VRM Cooling: Suitable for compatible graphics-card memory chips and voltage-regulation components requiring the specified thickness.
- M.2 SSD & Motherboard Cooling: Can be trimmed for SSDs, chipsets, memory modules, and integrated circuits with matching thermal-interface requirements.
- Wide Operating Temperature Range: Manufacturer-specified operating temperature range of −50°C to +250°C.
- Clean, Pre-Formed Installation: Cut to the required dimensions, remove the protective films, and position without spreading thermal grease.
- Non-Curing Silicone Material: Flexible thermal interface designed to remain non-curing rather than hardening into a rigid compound.
- Custom Cut-to-Fit Design: Trim the 85 × 45 mm sheet to individual component footprints while preserving its nominal 1.5 mm thickness.
- Laptop & Desktop Thermal Servicing: Suitable for compatible gaming PCs, graphics cards, laptops, workstations, and electronic assemblies.











Expert Specs
| Specification | Details |
|---|---|
| Brand | Maxtor |
| Model | AP-12 |
| Product Type | High-Performance Thermal Pad |
| Material | Silicone Thermal Interface Material |
| Thermal Conductivity | 14.8 W/m·K |
| Length | 85 mm |
| Width | 45 mm |
| Sheet Dimensions | 85 × 45 mm |
| Thickness | 1.5 mm |
| Shape | Rectangular, Cut-to-Fit Sheet |
| Color | Gray |
| Electrical Properties | Electrically Insulating / Non-Conductive |
| Compressibility | High Compressibility |
| Curing Behavior | Non-Curing |
| Operating Temperature | −50°C to +250°C |
| Hardness | 30–55 Sc (Manufacturer Notation) |
| Installation Method | Cut, Remove Protective Films, Position |
| Primary Applications | GPU VRAM/GDDR, VRM, Motherboard Components |
| Additional Applications | M.2 SSDs, Memory Modules, Chipsets, Integrated Circuits |
| Cooling Surface Compatibility | Suitable Heatsinks, Including Aluminum |
| Manufacturer-Listed Shelf Life | 5 Years |
| Manufacturer-Listed Compliance | RoHS, REACH, ISO (Specific ISO Standard Not Identified) |
Installation note: Use the 1.5 mm version only where the equipment requires that thickness. A thinner pad may not make complete contact; a thicker one could prevent the heatsink from seating correctly. Do not automatically substitute a thermal pad for thermal paste on a bare CPU or GPU die.













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