THERMALPAD 12.8W/M.K 120*15*1.5MM High Conductivity

USD 11.00 ---ONLY---

  • XCELLENT THERMAL CONDUCTIVITY – 120x15x1.5mm, Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
  • SUPER RELIABLE & DURABLE – High temperature performance in -40 ℃ – 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
  • EASY & CONVENIENT TO USE – Dimension 120x120x2mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals.
  • WIDELY APPLICATION – Perfectly replaces traditional heatsink compound grease paste, great for Control board, motor, electronics, CPU, GPU, Heat Sink, Power LED, auto mechanics, computer host, laptop, DVD, VCD, LID, Set-top box, LED IC SMD DIP and any cooling modules
Categories: ,
Reviews (0)

Reviews

There are no reviews yet.

Be the first to review “THERMALPAD 12.8W/M.K 120*15*1.5MM High Conductivity”

Your email address will not be published. Required fields are marked *

Shipping & Delivery

MAECENAS IACULIS

Vestibulum curae torquent diam diam commodo parturient penatibus nunc dui adipiscing convallis bulum parturient suspendisse parturient a.Parturient in parturient scelerisque nibh lectus quam a natoque adipiscing a vestibulum hendrerit et pharetra fames nunc natoque dui.

ADIPISCING CONVALLIS BULUM

  • Vestibulum penatibus nunc dui adipiscing convallis bulum parturient suspendisse.
  • Abitur parturient praesent lectus quam a natoque adipiscing a vestibulum hendre.
  • Diam parturient dictumst parturient scelerisque nibh lectus.

Scelerisque adipiscing bibendum sem vestibulum et in a a a purus lectus faucibus lobortis tincidunt purus lectus nisl class eros.Condimentum a et ullamcorper dictumst mus et tristique elementum nam inceptos hac parturient scelerisque vestibulum amet elit ut volutpat.