KINGBANK Soarblade RGB 32GB DDR5 Kit 6000MT/s (2×16GB) U-DIMM Memory, CL28, 1.45V, XMP 3.0, AMD EXPO, SK Hynix, 2mm Aluminum Heatsink | BLACK ~ K5.01.FLA5ED9401

Expert Features

• 32GB DDR5 Dual-Channel Kit : Includes 2×16GB DDR5 U-DIMM modules, giving gaming PCs, streaming rigs, creator builds, and heavy multitasking setups serious memory headroom with no weak-link energy.
• 6000MT/s DDR5 Performance : Runs up to 6000MT/s / PC5-class DDR5 speed, delivering faster bandwidth, smoother system response, and stronger next-gen performance on compatible DDR5 desktop platforms.
• CL28 Ultra-Tight Timing Profile : Tuned at CL28-35-35-76, this kit brings aggressive low-latency DDR5 performance for users who want serious speed, cleaner responsiveness, and enthusiast-grade memory behavior.
• 1.45V Performance Voltage : Operates at 1.45V to support its high-speed CL28 performance profile, built for compatible gaming and overclocking-ready DDR5 motherboards.
• Intel XMP 3.0 & AMD EXPO Support : Supports both Intel XMP 3.0 and AMD EXPO profiles, making it easier to activate optimized memory settings through BIOS on compatible Intel and AMD DDR5 systems.
• SK Hynix A-Die Chips : Uses Hynix A-Die ICs, a strong choice for high-performance DDR5 memory tuning, stability, and enthusiast-grade operation when paired with the right motherboard and CPU memory controller.
• Black Soarblade RGB Design : The black aluminum heat spreader with RGB lighting gives the kit a sharp, aggressive gaming look for black builds, RGB battlestations, tempered-glass cases, and high-performance desktops.
• Full RGB Sync Ecosystem : Supports synced ARGB lighting with mainstream motherboard platforms including ASUS, MSI, and Gigabyte, plus lighting ecosystems such as ASUS Aura Sync, Gigabyte RGB Fusion, ASRock Polychrome Sync, and MSI Mystic Light Sync.
• 2mm Aluminum Alloy Heatsink : Built with a thick 2mm aluminum heat spreader for stable heat dissipation, helping the memory maintain performance during gaming, productivity, and high-frequency operation.
• Thermal Silicone Heat Transfer : Uses thermal silicone between the DRAM chips and heat spreader to improve heat transfer and keep the modules cooler under demanding workloads.
• DDR5 PMIC Power Design : Equipped with DDR5 PMIC power management for improved onboard voltage regulation compared with older memory generations, giving the module a stronger next-gen performance foundation.
• On-Die ECC Support : Includes DDR5 on-die ECC technology for improved internal data correction inside the memory chip, helping support stable operation. This is not the same as registered/server ECC memory.
• 288-Pin Desktop U-DIMM Compatibility : Designed strictly for DDR5 desktop motherboards with 288-pin U-DIMM slots. It is not laptop SO-DIMM RAM and will not work in DDR4 motherboards.
• BIOS Update Recommended : For the smoothest setup, update the motherboard BIOS before enabling XMP 3.0 or AMD EXPO. Rated speed depends on motherboard support, BIOS version, and CPU memory controller quality.

 Expert Specs