“Halnziye HY510 Grey Thermal Grease 25g Syringe With 1.93W/m-K Conductivity, Low Thermal Impedance, Wide Temperature Range, High Insulation, Entry CPU & LED Module Cooling Paste” has been added to your cart. View cart
SKU:
HY710
HY710 Silver Thermal Grease 25g Syringe With 3.17W/m-k Conductivity, Low 0.067°C-in²/W Impedance, Wide -20~180°C Operation Range, DIY-Ready Silver Formula For CPU GPU Cooling
$ 6.00 ---ONLY---
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Description
Expert Features
- Silver-Infused Cooling Power: Loaded with Silver AGO & Silver powder, HY710 delivers a beefy 3.17 W/m-k thermal conductivity, giving CPUs and GPUs a chill pill during heavy workloads.
- DIY-Friendly Formula: Smooth application, stable texture (Thixotropic Index 350±10), and zero drama when spreading—engineered for PC builders, modders, and thermal-obsessed geeks.
- Low Thermal Impedance Dominance: With <0.067 °C-in²/W, heat transfer is swift, clean, and efficient—goodbye hotspots, hello stable clock speeds.
- High Temperature Resistance: Withstands brutal environments from -30°C to 220°C, and maintains operational stability between -20°C to 180°C.
- Electrically Insulating Safety: Insulating up to 0.5 kV, this formula protects components while keeping temperatures in the safe zone.
- Trusted Certifications: Passed SGS, ROHS, and SVHC—proving it’s not just powerful, but safe and environmentally responsible.
- Versatile Application Range: Perfect for CPUs, GPUs, automotive control modules, power conversion systems, LED lighting, network gear, notebooks, desktops, and more.
- Large DIY Syringe: Comes in a large 25g syringe that’s easy to apply, easy to store, and generous enough for multiple builds.
Expert Specs
| Specification | Details |
|---|---|
| Model | HY710 |
| Brand | HALNZIYE |
| Colour | Silver |
| Package | 25g Large Syringe |
| Thermal Conductivity | 3.17 W/m-k |
| Thermal Impedance | < 0.067 °C-in²/W |
| Specific Gravity | > 1.76 g/cm³ |
| Thixotropic Index | 350 ± 10 (1/10mm) |
| High Temperature Resistance | -30°C ~ 220°C |
| Operation Temperature | -20°C ~ 180°C |
| Ingredients | 20% Silicone Compounds, 20% Carbon Compounds, 60% Metal Oxide Compound |
| Applications | High Thermal Demand Modules, CPU/GPU, Engine Control, Power Conversion, LED Lighting, Desktop/Notebook PCs, Network Equipment, Home Appliances |
| Electrical Insulation | Breakdown Voltage 0.5 kV |
| Certifications | SGS, ROHS, SVHC |
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