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A4Tech Bloody B2100 Gaming Desktop COMBO
$ 32.00 Original price was: $ 32.00.$ 30.00Current price is: $ 30.00. ---ONLY---
SKU:
HY610
HALNZIYE HY610 Gold Thermal Grease 25g Large Syringe – 3.05W/m-K Conductivity, Low Impedance, -20~180°C Operation, CPU/GPU Cooling Paste for DIY PC Builders & High-Thermal Modules
$ 3.00 ---ONLY---
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Description
🧪 Expert Features
- Gold-Class Goop for DIY Legends – HY610 Gold Thermal Grease delivers 3.05W/m-K conductivity, perfect for CPUs, GPUs, and any component that screams “cool me or cook me.”
- Large 25g Syringe = Zero Rationing Mode – No more micro-dosing your paste; one big syringe means stress-free builds, multiple systems, and generous coverage for large heatsinks.
- Low Thermal Impedance <0.073°C-in²/W – Transfers heat faster than your GPU can say “why am I at 95°C?”
- Reliable From Frost to Furnace – Stable performance from –20°C to 180°C, with absolute survival range from –30°C to 220°C.
- Electrically Insulating – Safe around components; rated for >1kV breakdown, so your motherboard won’t get accidental shock therapy.
- Smooth Spread, Perfect Viscosity – Thixotropic Index 350±10 ensures controlled application; no dripping, no clumping, no rage-quits.
- SGS, RoHS, SVHC Certified – Build with confidence; your PC stays fast, not toxic.
- For Everything That Heats Up – CPUs, GPUs, VRMs, engine control modules, power converters, network devices, home appliances, and even industrial electronics.
- DIY-Friendly Application Method Included – Clean, dot, spread to 0.13–0.15mm, mount cooler, boom—optimal thermal transfer.
📘 Expert Specs Table
| Category | Details |
|---|---|
| Model | HY610-TU25B |
| Brand | HALNZIYE |
| Color | Gold |
| Package Size | 25g large syringe |
| Thermal Conductivity | 3.05 W/m-K |
| Thermal Impedance | <0.073 °C-in²/W |
| Specific Gravity | >2.33 g/cm³ |
| Thixotropic Index | 350 ± 10 (1/10mm) |
| High Temperature Resistance | –30°C to 220°C |
| Operating Temperature | –20°C to 180°C |
| Electrical Insulation | Breakdown voltage >1kV |
| Ingredients | 30% Silicone Compounds, 20% Carbon Compounds, 50% Metal Oxide Compound |
| Applications | CPU, GPU, high thermal modules, engine control, power conversion devices, desktops/laptops, networking gear, home appliances, electronics |
| Certifications | SGS, ROHS, SVHC |
| Form | Gold thermal paste/grease |
| Application Method | Clean → Apply small dot → Spread 0.13–0.15mm → Mount heatsink |




Keyboard
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